JRT METALLIZATION LINE

The JRT Metallization Line consists of Print Line and Test Line.

For the solar industry JRT is offering an industry standard-setting flexible system for the partial coating of silicon wafers by screen printing which ensures a high print quality combined with minimum breakage rates and low set up and maintenance times.

Technical data

Wafer size [mm]	156 x 156, 125 x 125
Wafer thickness [μm]	> 100
Wafer geometry	sq., pseudo-sq., rect.
Troughput/hour [gross]	2600 wph
Printorder	flexible BBF/FBB

 

Features

Breakage check / breakage reject	Standard
Print check front- and backside	Standard
Automatic buffer	Standard
APP (Advanced Print Positioning)	Optional
PQC (Process Quality Control)	Optional
FPP (Functional Paste Printer)	Optional
Double printing	Optional
Dual printing	Optional
Automatic paste feed	Optional
Paper check	Optional
MWT (Metal Wrap Through)	Optional
Selective Emitter	Optional
Laser edge isolation	Optional

Output data depends on the process parameters. The technical information is subject to change.